Cycle time optimized mini wave soldering
The EUTECT mini wave soldering modules IW1 and IW1-2 impress with excellent soldering results. A one-sided, non-wettable nozzle technology ensures a defined, stable solder wave and precise wetting of the solder joints. In combination with the horizontally integrated induction pump, a uniform, reproducible solder flow is achieved. EUTECT mini wave soldering modules are also characterized by their long service life and extremely high availability thanks to the shortest possible service and maintenance times.
The precise interaction of customer-specific nozzles, suitable solder masks and optimally designed workpiece carriers enables controlled heat input, reduces the risk of solder bridges and sustainably improves soldering quality. The result is an efficient, stable and economical selective soldering process.
Mini wave soldering modules IW1 and IW1-2 - for perfect soldering results
Together with the inductive solder pump system and exchangeable solder nozzles, the modular solder tank sizes form the powerful basic process module for a stable mini wave soldering process. Thanks to its modularity, the process can be optimally adapted to component sizes, throughput requirements and process parameters. Maximum process reliability is ensured by redundant temperature control and a constant solder bath level, which guarantee reproducible conditions over long production times. The solder wave height control supports precise process control, while continuous solder wire tracking ensures the supply. This ensures a high level of system autonomy, less operator intervention and consistent soldering quality.

The perfect automation for your mini wave soldering process
As part of a structured evaluation, we select the appropriate kinematics and automation modules together with the customer. Decisive factors here are the respective assembly requirements, possible workpiece carrier and mask concepts, desired cycle times and the planned production volume.
Depending on the task at hand, different combinations of cells, handling systems and process modules can be implemented. This modular diversity enables individual solutions that go far beyond standard systems and are tailored to the customer's requirements down to the last detail. Based on these automation options and in conjunction with the EUTECT in-house software, highly efficient, customized machine solutions with high process control and reproducible quality are created. Thanks to the versatile combination options, EUTECT develops automation concepts that precisely match the customer's target values, from maximum flexibility for product changes to high output and stable series production.
Individual, product-specific solder nozzles are a key component of the EUTECT mini-waves and guarantee reliable and cycle time-optimized solder wetting of the components and substrates to be soldered.
The adapted, single-sided, non-wettable solder nozzle and the resulting constant, laminar solder flow generate perfect results for the respective soldering process with a very long service life.
Point nozzle
The point nozzle enables particularly precise and targeted wetting of individual solder joints. Thanks to the focused, stably guided solder wave, even the smallest pads, narrow pin spacing and complex soldering geometries are soldered reliably without unnecessary heat input into neighboring areas. This makes the point nozzle ideal for demanding assemblies.
Line nozzle
The line nozzle enables particularly even and controlled wetting along a defined soldering line. It is ideal for applications where several solder joints need to be reliably soldered in one go, such as rows of pins or longer contact surfaces. The line nozzle ensures high process reliability, short process times and consistently high soldering quality.
Ring nozzle
Ring nozzles are used for the clean and reliable stripping and tinning of enameled copper wires in the manufacture of switching and transformation components, coilformers, magnetic heads, sensors and relays.
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Get a compact overview of EUTECT, our modular solutions for selective soldering and our automation concepts for reliable electronics production. Discover technologies, advantages and typical applications.
Use titanium solder masks and workpiece carriers from EUTECT in your mini wave soldering process and benefit from an integrated process solution, tailored to your individual requirements and based on many years of in-depth process knowledge.
Satellite wc with query, Poka Yoke and titanium masking
The robot only grips the upper satellite wc, which reduces the handling weight. Maximum precision is achieved thanks to the individual, product- and task-specific development and manufacture of the satellite wc. When changing products, only the satellite wc needs to be adjusted.
Smart assembly fixing with integrated titanium solder mask technology
Integrated placement queries and anti-twist devices ensure error-free placement. Sophisticated fixing of the assemblies, including mask technology, makes the workpiece carrier solderable on both sides and leads to reduced cycle times, minimized tool costs and maximum process stability.
Reliable handling
Our sophisticated solutions enable intelligent and cycle time-optimized handling of the assemblies, for precise, efficient and safe implementation of the individual process steps.
Process stability and product safety
Our intelligent solutions enable stable soldering processes and cycle time-optimized production steps for reliable, durable and defect-free end products.
Workpiece carriers for PCB panels and individual assemblies
The simultaneous reliable handling of PCB panels and individual assemblies enables a particularly economical implementation of selective soldering processes.
Do you need more information about our mini wave soldering solutions?
Whether you need individual advice, a specific project inquiry or technical questions, our team is always at your disposal. Use the contact form and talk to our experts about your selective soldering requirements.










